?In China, only our company has the production technology of the whole series of IC packages substrates. The company has a comprehensive and professional team in the production of punched lead frame, etching lead frame and package substrate; additionally, Fillgold is equipped with a complete set of equipment for production and detection such as high-speed precision press, high-speed alternative continuous plating line, automatic exposure machine, precision etching line and etc., with annual production capacity equivalent to 1.896 million square meters. To be specific, lead frame for punched high-density integrated circuit packaging is up to 1.08 million square meters, lead frame for etching high-density integrated circuit packaging 600 thousand square meters, double-faced package substrate for package substrate 48 thousand square meters, four-layer package substrate for package substrate 96 thousand square meters and six-layer package substrate for package substrate 72 thousand square meters.